A Novel Wafer Level Bonding/Debonding Technique Using an Anti-Adhesion Layer for Polymer-Based Zero-Level Packaging of RF Device

摘要

This paper reports on a simple wafer scale transfer technology for polymer-based zero-level packaging. By controlling the adhesive strength of the interface between the packaging material and the carrier wafer, the ablation process of carrier wafer is substituted with the mechanical separation of it. Surface modification technique using hydrophobic SAM is selected for the formation of an anti-adhesion layer. Prefabricated BCB packaging caps on the carrier wafer is wafer-level bonded with a Si substrate and released from the carrier wafer by mechanical detachment using a razor blade. In order to confirm the validity of the technique in RF applications, the insertion loss of BCB-encapsulated CPW lines is measured from DC to 70GHz.