Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

摘要

Electromigration (EM) tests were performed on Pb-free solder joints having different thicknesses of Ni UBM, to examine the effect of UBM thickness on EM reliability. The UBM thickness dependency of EM lifetime was explained in terms of the current crowdin