Evaluation of new substrate surface finish: Electroless nickel/electroless palladium/immersion gold (ENEPIG)

机译：新型基材表面的评价光洁度：无电镀镍/化学钯/浸渍金（ENEPIG）

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In this paper, we studied the wire bonding ability and the solder joint reliability for electrolytic Ni/Au and ENEPIG. For studying wire bonding ability, 4N wire with 20 mum in diameter was used. Pull strength of Au wire and failure mode after each pull t

机译：在本文中，我们研究了电解Ni / Au和Enepig的电解能力和焊点可靠性。为了研究引线粘合能力，使用具有20毫米直径的4N线。每次拉动后，拉丝的强度和故障模式

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来源
《Electronic Components and Technology Conference》|2008年||共5页
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作者
Chun-Hsien Fu; Liang-Yi Hung; Don-Son Jiang; Chiang-Cheng Chang; Wang Y.P.; Hsiao C.S.;
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原文格式 PDF
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中图分类 TN6-53;
关键词
failure analysis; gold alloys; lead bonding; nickel alloys; palladium alloys; reliability; scanning electron microscopy; solders; substrates; surface finishing; ENEPIG; cold-ball pull test; conventional ball shear test; drop test; electroless nickel-electroless pallad;

机译：失败分析;铅粘合;镍合金;钯合金;可靠性;扫描电子显微镜;焊料;表面精加工;Enepig;eNepig;冷球剪切试验;掉落试验;掉落试验;电镀镍普拉德;
入库时间 2022-08-20 19:48:43

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3. Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder [J] . Oda Yukinori, Fukumuro Naoki, Yae Shinji Journal of Electronic Materials . 2018,第4期

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4. Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 Solderability [C] . Jaspreet Gandhi, Shijian Luo, Tom Jiang 42nd international symposium on microelectronics (IMAPS 2009) . 2009

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机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
7. Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish [O] . Boo Nan Shing 2010

机译：无铅焊料与化学镍/浸金（ENIG）表面涂层之间的界面反应

Evaluation of new substrate surface finish: Electroless nickel/electroless palladium/immersion gold (ENEPIG)

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