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Improved Microcontact Test Fixture for Efficient Reliability and Performance Characterization

机译:改进的微接触测试夹具以实现高效的可靠性和性能表征

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In Microelectromechanical systems (MEMS) switches, the microcontact plays a crucial role in determining reliability and performance. Microcontact test fixtures facilitate to study micro contact surface physics, contact resistance, contact force, adhesion, and contamination research associated with microcontacts. Although AFM, SPM, and Nanoindentation based microcontact test setups are excellent at measuring adhesion, material transfer, contact resistance, and contact force, their performance is limited by low resonance beams and piezoelectric actuators. Moreover, these test stations are not optimized to simultaneously measure contact force and contact resistance in a unique ambient environment. To overcome these issues, Coutu et al. developed a novel microswitch lifecycle test fixture. In this work, we have proposed, designed, and simulated an microcontact support structure. We will fabricate the contacts using silicon on insulator (SOI) micromachining techniques which enable a very simple and efficient way of performing the postmortem analysis of microcontacts. The test fixture will be used to characterize the force/position and contact resistance/force performance parameters associated with wide range of contact materials and geometries that will facilitate designs for reliable, robust microswitches for future RF applications.
机译:在微机电系统(MEMS)开关中,微接触在确定可靠性和性能方面起着至关重要的作用。微接触试验夹具有助于研究与微接触相关的微接触表面物理,接触电阻,接触力,粘附和污染研究。虽然AFM,SPM和基于纳米indentation的微观试验设置在测量粘合性,材料转印,接触电阻和接触力时,但它们的性能受到低谐振梁和压电致动器的限制。此外,这些测试站未优化以同时测量独特的周围环境中的接触力和接触电阻。克服这些问题,Coutu等。开发了一种新型的微动截图生命周期测试夹具。在这项工作中,我们提出了设计和模拟了微观联系支持结构。我们将在绝缘体(SOI)微机械技术上使用硅制造触点,这使得能够实现微联系的后期分析的非常简单有效的方法。测试夹具将用于表征与宽范围的接触材料和几何形状相关的力/位置和接触电阻/力性能参数,这些参数将促进为未来RF应用程序提供可靠,强大的微型开关的设计。

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