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Interface degradation and dielectric breakdown of thin oxides due to homogeneous charge injection

机译:由于均匀电荷注入引起的薄氧化物的界面劣化和介电击穿

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The interface stability of 9- to 20-nm gate oxides is evaluated during homogeneous charge injection. In addition, the question of the extent to which interface degradation is correlated to dielectric breakdown is addressed. The measurements reveal that thinner oxides are more resistant to interface degradation. In addition, significantly reduced charge trapping in thin oxides results in improved threshold voltage stability. For both gate polarities, oxide breakdown exhibits no direct correlation to interface state density.
机译:在均匀的电荷注入期间评估9至20nm氧化物的界面稳定性。此外,解决了界面劣化与介电击穿相关的程度的问题。测量结果表明,较薄的氧化物更耐受界面劣化。此外,显着减少薄氧化物的电荷俘获导致改善的阈值电压稳定性。对于栅极极性,氧化物分解表现出与界面状态密度的直接相关性。

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