Coplanar waveguide based, dielectric coated flip chip monolithic microwave integrated circuit, a paradigm shift in MMIC technology

摘要

The status of a coplanar waveguide based, novel dielectric coated, mechanically rugged, flip-chip, monolithic microwave integrated circuit (MMIC) technology will be described. This technology is ideal for low-cost, multi-chip transmit/receive (T/R) module applications. Equivalent circuit and thermal models, and the fabrication procedure of flip-chip MMICs featuring T-shaped plated silver thermal bumps will be presented along with test results obtained on components designed using these circuit element models.