An Estimation Method of Electroplating Current Densities in LSI Fabrication Technology by Inverse Analysis of Electric Potentials in Cells

摘要

In this paper, we have developed a novel technique to estimate electroplating current densities from electric potentials in plating cells for LSI fabrication technology. This technique applies inverse analysis process for the estimation. We have also built a device for measuring electric potentials in the plating cell. Measurement experiments under several electroplating conditions were performed to demonstrate the validity of the proposed technique.