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Methods of forming electronic assemblies with inverse opal structures using variable current density electroplating

机译:使用可变电流密度电镀形成具有反蛋白质结构的电子组件的方法

摘要

A method of forming an inverse opal structure along a substrate that includes depositing polymer spheres along the substrate and electroplating the substrate and spheres at a first current density to form a first solid metal layer such that the spheres are raised from the substrate. The method includes electroplating the substrate and the spheres at a second current density to diffuse metals from the substrate and deposit the metal about the spheres. The second current density is greater than the first current density. The method includes electroplating the substrate and spheres to form a second solid metal layer disposed over the spheres, and removing the spheres to form the inverse opal structure disposed between the first and second solid metal layers. The first and second solid metal layers define planar interface surfaces disposed over a porous structure of the inverse opal structure.
机译:一种沿着基板形成反蛋白石结构的方法,该衬底包括沿着基板沉积聚合物球,并以第一电流密度电镀并形成第一固体金属层,使得球体从基板升高。该方法包括以第二电流密度电镀基板和球体以使来自基板的金属漫射并沉积金属绕球体。第二电流密度大于第一电流密度。该方法包括电镀基板和球体以形成设置在球体上的第二固体金属层,并去除球体以形成设置在第一和第二实体金属层之间的逆蛋白石结构。第一和第二固体金属层限定了设置在逆蛋白石结构的多孔结构上的平面界面表面。

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