The implications of self-consistent current density designguidelines comprehending electromigration and Joule heating forinterconnect technology evolution

摘要

We comprehend both electromigration and Joule heating to study forthe first time the self-consistent solutions for the maximum allowedinterconnect peak current density j_peak Using worst-case heatlosses, we show how these solutions can be used to generate adequatelysafe current density design guidelines. They indicate that thermaleffects will dominate the ability to increase j_peak, ratherthan EM capability of an interconnect system. Further increases inj_peak will have to come at some future time from technologyoptions which lower the temperature at which the interconnect operates