Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology

摘要

The viability of multimode high-speed transmission structures in 3D silicon system-in-package modules is examined with full-wave simulations. Multimode transmission is achieved by integrating a stripline into a dielectric filled waveguide built over a silicon substrate shielded with walls instead of the via fence used in the traditional substrate integrated waveguide (SIW) structure. Isolation and transmission properties are evaluated using the full-wave solver Ansoft HFSS. The improvement of shielding walls eliminates potential bandgaps, offers a more predictable response, and reduces attenuation at high frequencies by 10% on the TEM mode.