Fabrication of hybrid shielded-stripline using half substrate integrated waveguide and half shielded-stripline structures

摘要

A hybrid shielded-stripline (SS) for broadband TEM singlemode propagation up to 20 GHz is presented. Substrate integrated waveguide (SIW) technology is applied for designs of SS unhindered by the width and materials of the substrate. The hybrid structure, half SIW and half SS, which sandwich the buried-strip, is suggested for a simple fabrication. Therefore, the in-house vertical interconnection technique between two different planes on different substrates is proposed, which results in the realisation of the vias and the hybrid SS structures. The size of the hybrid SS, including transition, is 15.50 x 5.00 x 0.62 mm and the insertion loss is measured to be 1.45 dB/cm at 20 GHz.