Optimization of via structure in multilayer PCB for high speed signal transmission

机译：多层PCB中用于高速信号传输的通孔结构的优化

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44-layers PCB (Printed Circuit Board) for semiconductor test has been analyzed and optimized to improve the transmission performance. By dividing the PCB to subsections and analyzing each section, stub resonance reported in [1] brings the degeneration of transmission performance.

机译：已对用于半导体测试的44层PCB（印刷电路板）进行了分析和优化，以提高传输性能。通过将PCB分为多个部分并分析每个部分，文献[1]中报道的短线谐振会导致传输性能的下降。

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《Electrical Design of Advanced Packaging and Systems Symposium, 2008》||P.105-108|共4页
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Kang Bong-Gyu; Hyun Kim; Hee-do Kang; Yook Jong-Gwan;
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中图分类工业技术;
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4. Optimization of via structure in multilayer PCB for high speed signal transmission [C] . Kang Bong-Gyu, Hyun Kim, Hee-do Kang, Electrical Design of Advanced Packaging and Systems Symposium . 2008

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Optimization of via structure in multilayer PCB for high speed signal transmission

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