An Experimental Study on Mechanism of Precision Lapping Quartz Wafer

摘要

A lapping test for quartz wafer has been done on planetary plane-parallel lapping machine. Under different conditions of lapping plate materials, abrasive grain sizes and lapping parameters, the surface roughness and material removal rate have been measured. The lapped surface of quartz wafer and the surface of lapping plates inlaid with abrasive grain have been observed by SEM and stereomicroscope. Based on this experimental investigation, the lapping mechanism of quartz wafer has been explored in this paper too.