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High-Breakdown Depletion-Mode Ga_2O_3 MOSFETs with a Field Plate

机译:具有场板的高击穿耗尽型Ga_2O_3 MOSFET

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This work presents single-crystal Ga_2O_3 metal-oxide-semiconductor field-effect transistors (MOSFETs) with a gate-connected field plate (FP) for substantial enhancement in off-state breakdown voltage (H_(br)). A SiO_2 dielectric was used to serve a dual functionality for FP mechanical support as well as device surface passivation. The device channels, formed by selective-area Si ion implantation doping of an undoped Ga_2O_3 epilayer, were electrically isolated by the highly resistive epilayer without mesa etching. Effective surface passivation and high Ga_2O_3 material quality contributed to the absence of drain current collapse. The transistors exhibited an off-state V_(br) of 755 V, a high drain current on/off ratio of over 109, and stable high temperature operation against 300°C thermal stress.
机译:这项工作提出了具有栅极连接的场板(FP)的单晶Ga_2O_3金属氧化物半导体场效应晶体管(MOSFET),可大幅提高截止态击穿电压(H_(br))。 SiO_2电介质用于FP机械支撑和器件表面钝化的双重功能。通过未掺杂的Ga_2O_3外延层的选择性区域Si离子注入掺杂形成的器件通道通过高电阻外延层电隔离,而无需进行台面蚀刻。有效的表面钝化和高的Ga_2O_3材料质量有助于避免漏极电流崩溃。这些晶体管的截止状态V_(br)为755 V,高漏极电流开/关比超过109,并且在300°C的热应力下稳定的高温工作。

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