copper; integrated circuit bonding; integrated circuit design; integrated circuit interconnections; silver; three-dimensional integrated circuits; tin; Ansys Q3D; Cu-Ag; Cu-Ag microbumps; Cu-Cu; Cu-Cu direct bonding; Cu-Sn; Cu-Sn microbumps; SPICE-compatible equivalent circuits; TSV performance; bonding techniques; electromagnetic field solver; high-speed low loss vertical links; interconnect performance metrics; through silicon vias; vertical interconnects; Bonding; Capacitance; Integrated circuit interconnections; Measurement; Resistance; Three-dimensional displays; Through-silicon vias; 3D integrtation; Through-silicon-vias; bandwidth density; copper-copper direct bonding; delay; energy; microbumps;
机译:用于硅中介层的低损耗空气隔离式硅通孔
机译:带有硅通孔的硅中介层中的差分高速串行链路的信号完整性设计和分析
机译:用于太空探索任务的低功耗高速智能传感器设计
机译:通过硅通孔的设计空间探索,高速低损耗垂直链路
机译:用于HBT中低功耗高速数据链路设计的低压电流模式逻辑。
机译:基于RST-SOM算法的以双层设计空间为中心的以系统架构替代能力为重点的航空航天系统的探索
机译:基于优化的同步电路与系统设计框架 - 空间探索:高速链路示例
机译:用于太空探索任务的低功耗高速智能传感器设计