首页> 外文会议>Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International >Sub 30 nm multi-bridge-channel MOSFET (MBCFET) with metal gate electrode for ultra high performance application
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Sub 30 nm multi-bridge-channel MOSFET (MBCFET) with metal gate electrode for ultra high performance application

机译:具有金属栅电极的低于30 nm的多桥沟道MOSFET(MBCFET),用于超高性能应用

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We have successfully fabricated sub 30nm N+ poly and TiN gate MBCFET (multi-bridge-channel field effect transistor) both on SOI wafers and bulk-Si wafers. Using TiN metal gate and 20nm multi bridge channels, we achieved the drive current of 2.3mA/μm that is the largest drive current ever reported for pMOSFETs with excellent subthreshold swing of 75mV/dec, and drain induce barrier lowering (DIBL) of 36mV/V. Large Ion/Ioff ratio and excellent threshold voltage (Vt) distribution were obtained using TiN metal gate to eliminate channel ion implantation minimizing the mobility degradation and dopant fluctuation.
机译:我们在SOI晶片和Bulk-Si晶片上成功地制造了Sub 30nm N + Poly和TiN门MBCFET(多桥通道场效应晶体管)。采用锡金属闸门和20nm多桥通道,我们实现了2.3mA /μm的驱动电流,这是PMOSFET的最大驱动电流,具有优异的75mV / DEC的亚阈值摆动,排出诱导屏障降低(DIBL)36mV / V.使用锡金属栅极获得大的I on / i 关闭比率和优异的阈值电压(V t )分布,以消除最小化通道离子植入移动性降解和掺杂剂波动。

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