首页> 外文会议>Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International >RF power potential of 90 nm CMOS: device options, performance, and reliability
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RF power potential of 90 nm CMOS: device options, performance, and reliability

机译:90 nm CMOS的RF功率潜力:器件选件,性能和可靠性

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This paper presents the first detailed comparative study of the RF power potential of the various device options offered in a state-of-the-art 90 nm CMOS foundry technology. We show that at a constant voltage of 1 V, the nominal 90 nm thin gate-oxide logic devices offer the best performance, at Vdd = 1 V and 2.2 GHz showing over 20 dBm of output power and 59% PAE, as well as a power density of 34 mW/mm and 59% PAE at 8 GHz. If the operating voltage can be selected, 250 nm long thick gate-oxide I/O devices offer the highest power and efficiency at 2.5 V. However, when reliability considerations are included, the 90 nm digital devices outperform the 250 nm I/O devices. Overall, we find that the RF power performance of 90 nm CMOS exceeds the requirements for power amplifiers in a large variety of wireless high volume applications.
机译:本文介绍了最先进的90纳米CMOS铸造技术中提供的各种器件选件的RF功率潜力的详细比较研究。我们证明,在1 V的恒定电压下,标称90 nm薄栅极氧化物逻辑器件可提供最佳性能,在V dd = 1 V和2.2 GHz时,显示出超过20 dBm的输出功率和在8 GHz时,PAE为59%,功率密度为34 mW / mm,PAE为59%。如果可以选择工作电压,则250 nm长的栅极氧化物I / O器件在2.5 V电压下可提供最高的功率和效率。但是,如果考虑到可靠性,则90 nm数字器件的性能将超过250 nm I / O器件。 。总体而言,我们发现90 nm CMOS的RF功率性能超过了各种无线高容量应用中功率放大器的要求。

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