首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >The impact of sub monolayers of HfO2 on the device performance of high-k based transistors MOSFETs
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The impact of sub monolayers of HfO2 on the device performance of high-k based transistors MOSFETs

机译:HfO 2 的子单层对高k型晶体管MOSFETs的器件性能的影响

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Thin layers of ALCVD™ HfO2 were deposited on top of 1.5 nm SiON. At 5 growth cycles - resulting in less than 1 monolayer of HfO2 - the mobility is as low as 70% of the SiON control. Simulation results show that a fixed charge density of 3×1013 cm-2 at the poly-Si/HfO2 interface can explain this behavior. Two different kinds of poly-Si - in situ doped and implanted - result in different inversion capacitance. Both poly-Si varieties show similar VT shifts and mobility reduction. However, for in situ doped poly-Si, no poly depletion is observed whereas for implanted poly-Si it is.
机译:将ALCVD™HfO 2 的薄层沉积在1.5 nm SiON的顶部。在5个生长周期中-导致少于1个HfO 2 单层-迁移率低至SiON对照的70%。仿真结果表明,在poly-Si / HfO 2 界面上固定的电荷密度为3×10 13 cm -2 可以解释这种现象。 。两种不同类型的多晶硅-原位掺杂和注入-导致不同的反型电容。两种多晶硅均显示出相似的VT漂移和迁移率降低。然而,对于原位掺杂的多晶硅,没有观察到多晶硅耗尽,而对于注入的多晶硅,则是多晶硅耗尽。

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