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Nanoimprint Lithography for Augmented Reality Waveguide Manufacturing

机译:用于增强现实波导制造的纳米压印光刻

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Wafer-level nanoimprint lithography (NIL) has increasingly become a key enabling technology to support new devicesand applications across a wide range of markets. Leading manufacturers of augmented reality (AR) devices, opticalsensors and biomedical chips are already utilizing NIL and realizing the benefits of this technology, including the abilityto mass manufacture micro- and nano-scale structures down with a maximum degree of freedom for the devicedimensions. Another key advantage of this replication based technology is, given by the fact that even complexstructures which require precise and time consuming fabrication methods can be transferred to mass manufacturing in anefficient semiconductor manufacturing line. Additionally, for many devices especially for optical applications thereplicated layer can be directly used as functional layer in the product.Today NIL is considered as decisive process step for a number of emerging products, including AR waveguides. Withincreasing volumes the scaling of the production lines is crucial for most economical implementation of NIL. Inparticular for scaling to production lines using 200mm or even 300mm wafer sizes, the whole process chain has to beestablished. This is in particular a focus for AR devices requiring highly complex structures with tight specifications.Thus best efforts for master fabrication are crucial to obtain best performing devices. For smaller substrates, typicallyfull area masters are used to manufactured and used for the NIL process. However, as the masters are mainly fabricatedby sequential processes the costs scale with the pattern area. For 200mm and 300mm it has been proven to be viableoption to start with single high-quality devices and scale them by step and repeat (S&R) NIL to fully populated waferscalemasters and subsequently to use those for volume manufacturing on wafer-level. The wafer-level production itselfrequires then reliable replication of working stamps and wafer level nanoimprinting of these multiple devices on a singlewafer. As a result it is key for the high volume manufacturing to have a thorough understanding of all required patteringand replications steps to enable these large area manufacturing lines.
机译:晶圆级纳米压印光刻(NIL)日益成为支持新设备的关键使能技术 以及广泛市场中的应用。光学增强现实(AR)设备的领先制造商 传感器和生物医学芯片已经在利用NIL,并实现了该技术的优势,包括 大规模生产微米级和纳米级结构的器件,具有最大的设备自由度 方面。这种基于复制的技术的另一个关键优势在于,即使复杂 需要精确且耗时的制造方法的结构可以转移到批量生产中 高效的半导体生产线。此外,对于许多设备,尤其是光学应用, 复制层可以直接用作产品中的功能层。 如今,NIL已被认为是包括AR波导在内的许多新兴产品的决定性工艺步骤。和 不断增加的生产量规模对于最经济地实施NIL至关重要。在 特别是对于使用200mm甚至300mm晶圆尺寸的生产线进行缩放时,整个工艺链必须 已确立的。对于需要具有严格规格的高度复杂结构的AR设备而言,这尤其是重点。 因此,为获得最佳性能的设备,尽最大努力进行母板制造至关重要。对于较小的基材,通常 全面积母版用于制造和用于NIL过程。但是,由于大师都是伪造的 通过顺序处理,成本随图案面积成比例增加。对于200mm和300mm,它已经被证明是可行的 选择从单个高质量设备开始并逐步缩放并重复(S&R)NIL以完全填充晶圆规模的选项 掌握并随后将其用于晶圆级的批量生产。晶圆级生产本身 然后需要可靠地复制工作图章并在单个设备上对这些多个设备进行晶圆级纳米压印 威化饼。因此,对于大批量生产至关重要的是,必须全面了解所有需要的图案 复制步骤以启用这些大面积生产线。

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