首页> 外文会议>Instrumentation in Aerospace Simulation Facilities, 2001. 19th International Congress on ICIASF 2001 >High spatial resolution MEMS surface pressure sensor array fortransonic compressor IGV measurement
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High spatial resolution MEMS surface pressure sensor array fortransonic compressor IGV measurement

机译:高空间分辨率MEMS表面压力传感器阵列,用于跨音速压缩机IGV测量

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A high spatial resolution MEMS pressure sensor array consisting of60 transducers for the measurement of unsteady surface pressures on theinlet guide vane (IGV) of a transonic compressor rig is presented.Measurements from this sensor array will be used to investigatethree-dimensional unsteady vane/blade interaction aeromechanical forcingfunctions in a modern, highly loaded compressor stage. Included aredetails of the design and construction of the MEMS array and electronicinterrogation circuitry used for acquisition of the 60 transducersignals using the available data acquisition system. In addition, theMEMS pressure sensor array is used to acquire experimental data. Asample of the data is reduced and shown to give excellent agreement bothin the time and frequency domain when compared with previousinstrumentation using traditional individual sensor mounting methods.Finally, a significant cost saving of 44% in instrumenting the IGV isrealized over traditional instrumentation methods along with substantialbenefits in the handling of the sensor wiring
机译:高空间分辨率MEMS压力传感器阵列,包括 60个传感器,用于测量传感器上的不稳定表面压力 介绍了跨音速压缩机装置的进气导叶(IGV)。 来自此传感器阵列的测量将用于调查 三维非定常叶片/叶片相互作用气动力学强迫 在高负荷的现代压缩机阶段发挥作用。包括 MEMS阵列和电子器件的设计和构造细节 用于采集60换能器的询问电路 使用可用的数据采集系统发出信号。除此之外 MEMS压力传感器阵列用于获取实验数据。一种 数据样本减少并显示出极好的一致性 与以前的相比,在时域和频域 使用传统的单个传感器安装方法进行检测。 最后,在安装IGV时可节省44%的成本 通过传统的仪器方法实现了 有利于处理传感器接线

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