首页> 外文会议>Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1999. 21st Annual >InP/GaAsSb/InP DHBTs with high fT and fMAXfor wireless communication applications
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InP/GaAsSb/InP DHBTs with high fT and fMAXfor wireless communication applications

机译:f T 和f MAX 高的InP / GaAsSb / InP DHBT用于无线通信应用

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We study the DC and microwave performance of MOCVD-growncarbon-doped InP/GaAsSb/InP double heterojunction transistors (DHBTs)with high cut-off frequencies. A maximum cutoff frequency of 106 GHz isobtained while maintaining a relatively high breakdown voltage(BVCEO=8 V) in devices with a 2000 Å InP collector. Inthese devices, the maximum frequency of oscillation is limited by theGaAsSb base sheet resistance (which is high in comparison to GaAs orGaInAs conventional bases), and high fMAX values can only beachieved by scaling the devices to simultaneously reduce the total baseresistance RB and the base-collector capacitance CBC. A new self-aligned process was developed which results infT=80 GHz and CBC=90 GHz for devices with a 3000Å collector and a 1 μm emitter stripe fabricated by contactlithography and all-wet etching
机译:我们研究了MOCVD生长的直流和微波性能 碳掺杂InP / GaAsSb / InP双异质结晶体管(DHBT) 具有高截止频率。最大截止频率为106 GHz 在保持较高击穿电压的同时获得 (BV CEO = 8 V)在带有2000ÅInP集电极的设备中。在 这些设备的最大振荡频率受 GaAsSb基础薄层电阻(与GaAs或 GaInAs常规基数)和较高的f MAX 值只能是 通过扩展设备以同时减少总基数来实现 电阻R B 和基极-集电极电容C BC 。开发了一种新的自我调整过程,该过程导致 对于具有3000的设备,f T = 80 GHz和C BC = 90 GHz 通过接触制作的Å集电极和1μm发射极条 光刻和全湿蚀刻

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