Inclusion of topside metal heat spreading in the determination ofHBT temperatures by electrical and geometrical methods GaAs devices

摘要

Topside metal helps spread the heat dissipated by HBTs and reducesboth the thermal resistance at a given temperature, and its temperaturedependence. In this paper we describe new methods for including topsidemetal cooling effects in both an electrical method of extracting HBTtemperature and a geometry-based method for calculating HBT temperatures