Solder joint crack propagation in plastic and ceramic packageddiodes mounted on insulated metal substrate

摘要

The first objective of this paper is to identify some key designparameters for ceramic and plastic packaged diodes mounted on insulatedmetal substrate (IMS). The second objective is to predict their solderjoint life. IMS is a metal substrate used to enhance heat dissipation inhigh power application. The key parameters analyzed are dielectricthickness, solder thickness and board material. Identifying the criticalparameters is useful to increase the solder joint life especially for aceramic package, which has a high CTE mismatch with the aluminumsubstrate. Experiments are conducted to study the crack growth rate andidentify solder joint failure. Two models to predict the crackpropagation in eutectic solder joint are considered, the Darveaux andthe Energy Partitioning model