Finite element modelling is widely used for estimating the solderjoint reliability of electronic packages. However, the solder propertiesare strong process and geometry dependent. Even for the same type ofsolder, measurements conducted by different people at differentlocations show different results, due to differences in applicationconditions, benching etc. Those differences may lead to difference inconstitutive equations and/or the parameter values. Therefore the effectof the solder parameter variation and parameter sensitivity should betaken into account before a reliable solder fatigue prediction can bemade. In this research, simulation-based optimisation method is used toinvestigate the sensitivity of the chosen solder parameters for thesolder fatigue prediction using inelastic strain criterion
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