Combination of numerical and experimental methods for stressanalysis of small electronic components

摘要

Examples of the development of a multichip module with extremelyloaded components are presented. They show that a reasonable combinationof experimental methods, e.g. holographic interferometry, metallography,and a good knowledge of the specific material behavior under workingconditions, results in better numerical simulation under realisticboundary conditions. Optimized finite-element method models and theirboundary conditions based on experimental results allow shape andmaterial optimization during the development phase to achieve componentswith high reliability in a short development time by minimizing therequired number of prototypes