Combination of numerical and experimental methods for stress analysis of small electronic components

摘要

Examples of the development of a multichip module with extremely loaded components are presented. They show that a reasonable combination of experimental methods, e.g. holographic interferometry, metallography, and a good knowledge of the specific material behavior under working conditions, results in better numerical simulation under realistic boundary conditions. Optimized finite-element method models and their boundary conditions based on experimental results allow shape and material optimization during the development phase to achieve components with high reliability in a short development time by minimizing the required number of prototypes.