Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGAlaminate assembly

摘要

Component integration is becoming more and more popular to achievereduction of space with increasing performance of electronic packages.Dual-Chip-Stack (DCS) is the direct, face to face joining of two (ormore) semiconductor devices. It improves significantly componentintegration by leveraging flip-chip technology processing, standardwirebond packaging and plastic ball grid array (PBGA) processes. Highbandwidth interconnections between devices of various processtechnologies allow the construction of unique, high margin componentassemblies. In this paper, the authors describe the assembly developmentwork of a DCS package using a logic device attached to a DRAM deviceover a PBGA chip-up type carrier. Proposed packaging flow is discussedwith process modifications to obtain a robust product. The processesdiscussed are: flip-chip dicing, device to device joining, wirebond tolaminate carrier, and encapsulation (Underfill and Globtop). Somereliability results will also be shown and discussed