In this paper, we firstly introduce a new type of high-densitypackage, called as Multiple Line Grid Array (MLGA) package. The MLGApackage is developed as a strong candidate for next-generation,cost-effective, and high-density package manufactured by GLOTECH Inc.Moreover, the MLGA package not only provides excellent electricaltransfer characteristics for high-frequency applications over 10 GHz,but also has improved thermal conductance of heat dissipation. We usedthe model parameter extraction procedure using network analyzer HP8510and cascade probe, and the cascade transmission matrix conversion wasperformed to extract the equivalent circuit model parameters of the MLGApackage. Two types of the MLGA packages were fabricated using ceramicand polymer. As a result of the model parameter extraction, theparasitic inductance and the parasitic capacitance were shown to be lessthan 0.34 nH and 0.33 pF, respectively for the MLGA package of 500 μmheight, demonstrating the applications in the frequency range of over 10GHz
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