Characterization of a flip-chip interconnect at frequencies up to30 GHz

摘要

In this paper, a coplanar-waveguide on the mother board connectedby a bump with another coplanar-waveguide on the chip is analyzed in therange of frequencies between 1 GHz and 30 GHz. Various package-schemesof a flip-chip are presented and analyzed. The variations include thelength of the overlap of the cpw on the mother-board and the cpw on thechip. It is concluded that the overlap of the coplanar waveguides is oneof the most important parameters which determine the characteristics ofthe bump-connection. Based on the S-parameters, the important physicalparameters of the bump-connections are analyzed and recommendations aremade concerning the bump connection. The S-parameters are used in orderto calculate the Y-parameters, from which the circuit model is obtained.The parameters of the circuit model are calculated and demonstrated forfrequencies between 1 GHz and 30 GHz. The results presented in thispaper are obtained by a method of moment