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Wafer Backside Coating?? of Electrically Conductive Die Attach Adhesives for Packaging of Discrete Semiconductor Devices

机译：晶圆背面涂层？离散半导体器件包装用导电模片附着胶粘剂

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《Electronics Packaging Technology Conference, 2008 10th》||P.291-295|共5页
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Winster Tony; van Rijckevorsel Hans; Lui Ben; Zhuo Qizhuo;
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中图分类工业技术;
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4. Wafer Backside Coating?? of Electrically Conductive Die Attach Adhesives for Packaging of Discrete Semiconductor Devices [C] . Winster Tony, van Rijckevorsel Hans, Lui Ben, Electronics Packaging Technology Conference . 2008

机译：晶圆背面涂层？导电模具附着用于包装离散半导体器件的粘合剂
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