首页> 外文会议>Electromagnetic Compatibility Symposium Record, 1968 IEEE >Multi-layer carbon nitride thin films prepared by repeated process of carbon sputter-deposition and nitrogen ion implantation
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Multi-layer carbon nitride thin films prepared by repeated process of carbon sputter-deposition and nitrogen ion implantation

机译:通过碳溅射沉积和氮离子注入的重复过程制备的多层氮化碳薄膜

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Multi-layer carbon nitride (CNx) films have been deposited onto Si (100) substrates by repeated process of DC magnetron sputter-deposition and nitrogen ion beam (N+/N2+) implantation. The composition, bonding structure and mechanical properties of multi-layer CNx films prepared by the repeated process were investigated. Depth profile studies by X-ray photoelectron spectroscopy (XPS) showed that it is possible to control the layer structure by regulating sputter deposition time and ion beam energy in the repeated process. Two different films were fabricated and compared. The one is a multi-layer film of carbon and carbon nitride and the other is a homogeneous layer film of carbon nitride. Measurements of internal stress of the films showed compression. Variation in the morphology of multi-layer CNx films and non-irradiated CNx film deposited by pure N2 gas sputtering was examined by scanning electron microscopy (SEM). Nanoindentation studies revealed that the hardness of multi-layer CNx films was higher than that of non-irradiated CNx film.
机译:通过直流磁控溅射和氮离子束(N + / N2 + )植入。研究了通过重复工艺制备的多层CNx薄膜的组成,结合结构和力学性能。通过X射线光电子能谱(XPS)进行的深度剖面研究表明,可以通过在重复过程中调节溅射沉积时间和离子束能量来控制层结构。制作并比较了两种不同的薄膜。一个是碳和氮化碳的多层膜,另一个是氮化碳的均质层膜。膜的内部应力的测量显示压缩。通过扫描电子显微镜(SEM)检查通过纯N 2气体溅射沉积的多层CN x膜和未辐照的CN x膜的形态变化。纳米压痕研究表明,多层CNx膜的硬度高于未辐照的CNx膜。

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