Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

摘要

Several of the critical drawbacks to existing failure analysis imaging techniques, including the low resolution of common non-destructive techniques and the destructiveness and slow speed of FIB/SEM, can be resolved by using X-Ray Micro Computed Tomography (MicroCT) as a complementary technique. In this the paper, we describe examples of the use of X-Ray MicroCT following TDR as non-destructive technique to isolate solderability and bump void failure mechanisms. Also, use of X-Ray MicroCT for package construction analysis is described.