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1D and 2D Time-Resolved Emission Measurements of Circuits Fabricated in 14 nm Technology Node

机译:14 nm技术节点中制造的电路的一维和二维时间分辨发射测量

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Time-Resolved Emission (TRE) measurements for circuit debugging, fault localization, and circuit characterization are discussed along with recent detectors developments that have improved their low-voltage sensitivity, while maintaining an excellent jitter and low noise performance. Advantages and disadvantages of TRE methodologies are discussed and contrasted with laser probing techniques. 14 NM test cases are presented for logic debug, SRAM characterization, and early technology development. Finally, several advanced applications that are mostly unique to TRE are summarized. TRE has a unique capability to contribute to test and diagnostics applications, especially when conditions make laser-based technique difficult to use due to its invasiveness and the lack of resolution.
机译:讨论了用于电路调试,故障定位和电路表征的时间分辨发射(TRE)测量,以及最近的检测器开发,这些改进了其低电压灵敏度,同时保持了出色的抖动和低噪声性能。讨论了TRE方法的优缺点,并与激光探测技术进行了对比。提出了14个NM测试用例,用于逻辑调试,SRAM表征和早期技术开发。最后,总结了几个TRE特有的高级应用程序。 TRE具有独特的能力,可为测试和诊断应用做出贡献,特别是当条件由于其侵入性和缺乏分辨率而使基于激光的技术难以使用时。

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