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Site-Specific Sample Preparation and Analysis of FinFET structure in 14nm Technology Node Chip via Atom Probe Tomography

机译:通过原子探针层析成像技术进行14nm技术节点芯片中特定位置的样品制备和FinFET结构分析

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At present the atom probe tomography (APT) has shown its advantage to analyze dopant distributions in FinFET devices with sub-nm 3D-resolution and good dopant sensitivity. Preparing samples for APT analysis can carry significant challenges. The main limiting factor with respect to the type of problems that can be addressed is the small volume investigated and the randomness of common sample preparation methods. An improved method utilizing focused ion beam (FIB) is presented that can be used to site-specific produce atom probe samples with features of interest at any desired orientation with an accuracy of better than 10 nm from samples of 14 nm FinFET devices. The sample analysis provides three dimensional compositions of Fin channel, metal gate and high-k oxide of the FinFET structure. Finally, the reconstruction data is discussed and the measurement is also compared with high resolution STEM-EDS analysis.
机译:目前原子探测断层扫描(APT)显示了其优点,用于分析具有子NM 3D分辨率和良好掺杂剂敏感性的FinFET器件中的掺杂剂分布。为APT分析制备样品可以承受重大挑战。关于可以解决的问题类型的主要限制因素是研究的小体积和常见样品制备方法的随机性。提出了一种利用聚焦离子束(FIB)的改进方法,其可用于现场专用的产生原子探针样品,其具有感兴趣的特征在任何所需取向,精度从14nm FinFET器件的样品优于10nm。样品分析提供了三维组成的翅片通道,金属栅极和FinFET结构的高k氧化物。最后,讨论了重建数据,并且还与高分辨率茎EDS分析进行了测量。

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