The wireless transmission circuit consists of power amplifier and heatsinks which is a 3D structure. Heatsinks are normally designed to be near power amplifier circuit. The heatsink radiations are undesirable for some applications and should be minimized to reduce electromagnetic interference (EMI). However in certain applications the design of heatsinks are unavoidable. The use of heatsink as a radiating or receiving electromagnetic radiation will be of significant value if heatsink is designed as an antenna. The fabrication of 3D antennas depends on the designed resonant frequency. As the antennas are made smaller physically, their resonant frequency increases, so building millimeter-wave capable antennas using conventional semiconductor processing techniques becomes feasible. The fabrication of on-chip antenna heatsinks for high frequency radiations can be visualized using a novel self assembly process. The self assembly (SA) technique is driven by surface tension property to pull the 2D metal patterns into 3D structures. The SA method involves conventional semiconductor steps with an additional dip soldering and reflow steps to develop 3D antennas. In our previous paper we have investigated antenna properties of 3D structures as an antenna for two different frequencies: low (2.4 GHz) and high (23.78 GHz) frequencies. This paper provides the simulation of truncated square pyramid (TSP) 3D structures which has high fabrication yield among all other structures. The simulation of TSP structures as an antenna is also demonstrated.
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