3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications

摘要

This paper reports the first demonstration of antenna-in-package and seamless antenna-to-receiver signal transitions on panel-scale processed ultra-thin glass substrates, for high-speed 5G communication standards in the 28 GHz band. To demonstrate the benefits of g 1 ass for 5 G communications, package-integrated antennas with feedlines were modeled and designed on ultra-thin glass substrates laminated with low-loss dielectric thin films for highest bandwidth and efficiency in the mm-wave bands. The measured results for a miniaturized Yagi-Uda antenna, transmission lines, and through-package vias showed superior dimensional stability and good agreement with the simulated values on 100 µm glass substrates. The results showed low interconnect signal losses with a microstrip line loss of 0.108 dB/mm, and a through-package via loss of 0.095 dB/TPV. The Yagi-Uda antenna fabricated on glass substrates showed a center frequency of 28.18 GHz with a fractional bandwidth of 21.1%. The antenna also presented a wide-angle main lobe at the target frequency range implying good coverage of signal transmitting and receiving. The performance of package-integrated antenna, feedlines, through-package vias, and transmission lines on glass substrates was benchmarked in comparison to other 5G substrate technologies such as organic laminate, ceramic-based substrates, or fan-out wafer level packaging.