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Analysis of lateral surface leakage in the vicinity of Schottky gates in AlGaN/GaN HEMTs

机译:Algan / GaN Hemts附近横向​​表面泄漏分析

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Schottky gates on AlGaN/GaN HEMTs are reducing their size to nanometer-scale region for the demand of further high-frequency operation. In those devices, the gate leakage includes not only one dimensional transport, normal to the Schottky interface, but also lateral electron injection from the gate edge. In the latter case, we have to pay attention to the laterally injected charges to the surface states because they can cause the instability of device operation. However, the mechanism of lateral leakage current in the vicinity of Schottky gates is not understood yet for the AlGaN/GaN HEMTs. In this paper, we systematically characterize surface leakage current in the vicinity of Schottky gates on the AlGaN/GaN heterostructure, separating it from the normal leakage current through the Schottky interface.
机译:AlGaN / GaN Hemts上的肖特基栅极在进一步高频操作的情况下将其尺寸降低到纳米级区域。在这些装置中,栅极泄漏不仅包括施特基界面的一维传输,还包括来自栅极边缘的横向电子注入。在后一种情况下,我们必须注意横向注入的表面状态,因为它们可能导致设备操作的不稳定性。然而,对于AlGaN / GaN Hemts,尚未理解肖特基门附近的横向漏电流的机理。在本文中,我们在AlGaN / GaN异质结构上系统地表征了肖特基栅附近的表面漏电流,通过肖特基界面将其与正常漏电流分开。

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