Design and Optimization of a 130-GHz Wire Bond Interconnection

摘要

This paper presents a novel compensation technique for design optimization of a 130-GHz wire bond interconnection structure. It consists of coplanar bonding wires and multisectional matching circuit which is designed based on a single-objective optimization method. The simulating results show high performance of the optimized structure with a bandwidth of up to 8%. The impact of process tolerances is investigated, which demonstrates the robustness of the proposed design. Finally, the reliability of the wire bond interconnection is studied. The temperature and stress distributions of the structure with electrostatic discharge (ESD) injection are given.