首页> 外文会议>ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems >CYLINDRICAL TUBER ENCAPSULANT LAYER REALIZATION BY PATTERNED SURFACE FOR COB-LEDS PACKAGING
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CYLINDRICAL TUBER ENCAPSULANT LAYER REALIZATION BY PATTERNED SURFACE FOR COB-LEDS PACKAGING

机译:图案表面实现圆柱管密封剂层封装COB-LEDs的应用

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In this study, we proposed a flexible method to realize a cylindrical tuber encapsulant layer. Firstly, patterned LED substrate with silicone-wetting and silicone-repellency surfaces was prepared by depositing low surface energy modified nano-silica particles. Secondly, coating phosphor gel onto the LED chip. Thirdly, coating the encapsulant (silicone OE6550A/B) onto the phosphor gel layer. The silicone stops spreading at the border of silicone-wetting and silicone-repellency surfaces and its final contact angle can be adjusted to any value between the contact angle of silicone-wetting and silicone-repellency surface, so it is very easy to realize dome-shape silicone layer with contact angle of ~90°. For COB-LEDs with LED array in series, the final silicone layer geometry is similar to the cylindrical tuber. The results show that compared to the conventional flat encapsulant layer, the proposed encapsulant layer can improve the light efficiency by >60% for pure blue light and 13.6% for white light at correlated color temperature (CCT) of ~5500K.
机译:在这项研究中,我们提出了一种灵活的方法来实现圆柱形块茎包封层。首先,通过沉积低表面能改性的纳米二氧化硅颗粒,制备出具有有机硅润湿性和有机硅排斥性表面的图案化LED基板。其次,将磷光体凝胶涂覆到LED芯片上。第三,将密封剂(硅酮OE6550A / B)涂覆到荧光粉凝胶层上。硅酮在硅酮润湿和硅酮排斥表面的边界处停止扩散,并且其最终接触角可以调节为硅酮润湿和硅酮排斥表面的接触角之间的任何值,因此很容易实现圆顶接触角约为90°的有机硅层。对于串联LED阵列的COB-LED,最终的有机硅层几何形状类似于圆柱形块茎。结果表明,与传统的平面密封剂层相比,在约5500K的相关色温(CCT)下,所提出的密封剂层对纯蓝光的光效率提高了60%,对白光的光效率提高了13.6%。

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