LEAD FRAME HAVING BARRIER LAYER FOR FINE PATTERN AND PITCH REALIZATION AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

Disclosed are a lead frame including a barrier layer for fine pattern and pitch implementation, designed for implementing a fine pattern and a fine pitch by arranging the barrier layer between a lead line and a metal bump with a very thin thickness, a manufacturing method thereof, and a semiconductor package thereof. The lead frame including a barrier layer for fine pattern and pitch implementation according to the present invention includes the lead line which has an upper side and a lower side and includes a through hole passing through the upper and lower sides and a solar ball attachment side arranged on the lower side; a resin layer inserted into the through hole of the lead line; the metal bump arranged on the upper sides of the resin layer and the lead line; and the barrier layer arranged on the lower side overlapping with the metal bump.