APPLICATION OF ECT TECHNIQUE FOR INSPECTION OF BARE PCB

摘要

The eddy-current testing (ECT) technique gives the new skill for inspection of bare printed circuit board(PCB). The high-sensitive ECT probe [1],[2] and the image processing technique[3],[4] enables us to detect damages(disconnection, chipping crack, imperfection of thickness and short circuit) on the trace of printed circuit. We discussed both the structure of the planar type probe and the image processing. This paper deals with the probe structure and characteristics to apply the ECT approach to high-density PCB with narrow trace width.