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Microcracks of Thin-Film Head Alumina II: read-write performance, corrosion, magnetic head design.

机译:微裂纹薄膜头氧化铝II:读写性能,腐蚀,磁头设计。

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In our previous report on the study of the microcracks of the thin-film head alumina it was shown that the thermal expansion of the head wires reduces the crack resistance of the magnetic head alumina and therefore increases the possibility of the head damage in the low flying height magnetic disk drives. The fatigue surface crack of the head alumina initiated at the flaw or at the chipping site is growing toward the head pole tips and propagate either through the head gap or under the leading pole [1]. In this paper we discuss the effects of the crack on the read-write performance of the magnetic head; corrosion effects which are associated with the alumina cracks; the ways of reducing the stress induced by the thermal expansion of the head materials at the areas which interact with the rotating disk surface most frequently (front edges of the alumina).
机译:在我们之前关于研究薄膜头氧化铝的微裂纹的研究报告,表明头部线的热膨胀降低了磁性头氧化铝的抗裂性,因此增加了磁头损坏在低飞行中的可能性高度磁盘驱动器。在瑕疵或碎位部位发起的头氧化铝的疲劳表面裂纹朝向头部尖端延伸,并通过头部间隙或在引导杆下方传播[1]。在本文中,我们讨论了裂缝对磁头读写性能的影响;与氧化铝裂缝相关的腐蚀效果;通过最常与旋转盘表面相互作用(氧化铝的前边缘)在与旋转盘表面相互作用的区域处减少磁头材料的热膨胀引起的应力的方法。

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