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High Performance InGaAs Gate-All-Around Nanosheet FET on Si Using Template Assisted Selective Epitaxy

机译:使用模板辅助选择性外延在Si上的高性能InGaAs全方位纳米片FET

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We report InGaAs gate-all-around nanosheet NFETs on Si substrate using template-assisted-selective-epitaxy (TASE) and a gate-last process with thermal budget advantages. Compared to our early report of the TASE process, in this paper we demonstrate that TASE can be scaled to a channel thickness of ~10 nm, which enables short gate devices without significant leakage. The defects and composition of the fabricated nanosheet FETs are also investigated. Enabled by this VLSI compatible process and a novel high-pressure deuterium annealing process, our 39 nm-Lg device shows a peak gm of 1.37 mS/μm, a subthreshold slope in saturation of 72 mV/decade, and an Ion of 355 μA/μm at 0.5 V Vgs, the highest among reported sub-50 nm-Lg III-V FETs on Si.
机译:我们报告了使用模板辅助选择性外延(TASE)和具有热预算优势的后栅极工艺在Si衬底上的InGaAs全方位栅纳米片NFET。与我们对TASE工艺的早期报告相比,本文证明了TASE可以缩放至〜10 nm的沟道厚度,这使短栅器件无显着泄漏。还研究了制造的纳米片FET的缺陷和组成。通过这种VLSI兼容工艺和新颖的高压氘退火工艺,我们的39 nm-L g 设备显示峰值g m 在0.3 V时的饱和度为1.37 mS /μm,亚阈值饱和度为72 mV /十倍,离子为355μA/μm gs ,在报道的低于50 nm-L的样品中最高 g Si上的III-V FET。

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