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Investigation of high-k HfN multilayer gate dielectrics for MISFET fabricated with Si surface flattening

机译:用Si表面扁平化制造MISFET的高k HFN多层栅极电介质研究

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In this paper, we have investigated MISFETs with HfNxmultilayer gate dielectrics fabricated with Si surface flattening process. The ID- VGcharacteristics of fabricated MISFETs with 2- and 4-layer gate dielectrics showed negligible hysteresis and excellent subthreshold swing (SS) of 71.6 and 72.5 mV/dec., respectively. This is attributed of Si surface flattening process. Furthermore, although the thickness of gate dielectrics was increased by increasing the number of dielectric layers, the extracted equivalent oxide thickness (EOT) showed similar value. Furthermore, the on/off current (Ion/Ioff) ratio was increased by one order of magnitude.
机译:在本文中,我们已经使用HFN调查了MISFET x 具有Si表面扁平工艺制造的多层栅极电介质。我 d - V. g 具有2-和4层栅极电介质的制造MISFET的特性显示出可忽略不计的滞后和71.6和72.5mV / DEC的优异亚阈值摆动(SS)。这归因于SI表面平坦化过程。此外,尽管通过增加介电层的数量来增加栅极电介质的厚度,但是提取的等效氧化物厚度(EOT)显示出类似的值。此外,ON / OFF电流(I上/一世关闭)比例增加了一种数量级。

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