首页> 外文会议>ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems >RELATIONSHIP BETWEEN THRESHOLD CURRENT DENSITY OF ELECTROMIGRATION DAMAGE CONSIDERING VOID AND HILLOCK FORMATION AND RESERVOIR SHAPE IN INTERCONNECT LINE
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RELATIONSHIP BETWEEN THRESHOLD CURRENT DENSITY OF ELECTROMIGRATION DAMAGE CONSIDERING VOID AND HILLOCK FORMATION AND RESERVOIR SHAPE IN INTERCONNECT LINE

机译:互连线中电蚀和形成的电晕损伤的阈值电流密度与储层形状的关系

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Reservoir structures are often constructed in the interconnection to prevent the electromigration damages. In this study, a numerical simulation technique for analyzing the atomic density distributions in the line under high current density was used to evaluate the effects of reservoir length and location on the threshold current density considering void and hillock generations. The threshold current density is determined when the local atomic density in the line reaches the upper critical value for hillock creation or the lower critical value for void generation. Atomic density distributions in the line were simulated when cathode and anode reservoir lengths were changed. The threshold current density considering void formation became higher with longer cathode reservoir and shorter anode reservoir. However, opposite results obtained in the case of hillock formation. It was found that there was an optimum value of reservoir length, corresponding to both critical values of hillock and void initiation.
机译:通常在互连中构造储层结构,以防止电迁移损坏。在这项研究中,使用一种数值模拟技术来分析高电流密度下管线中的原子密度分布,以评估考虑空隙和小丘世代的储层长度和位置对阈值电流密度的影响。当生产线上的局部原子密度达到产生小丘的上临界值或产生空隙的下临界值时,确定阈值电流密度。当阴极和阳极储层长度改变时,模拟生产线中的原子密度分布。考虑到空洞形成的阈值电流密度随着较长的阴极储层和较短的阳极储层而变得更高。但是,在小丘形成的情况下获得相反的结果。发现有一个最佳的储层长度值,与小丘的临界值和孔隙引发都相对应。

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