Development of Novel BN Filler for High Thermal Conductivity Packaging Material

摘要

Novel low aspect ratio primary hexagonal Boron Nitride (BN) particles and agglomerated BN filler were developed by carbo-thermal-reduction and nitridation (CRN) method in this study. They were used as high thermal conductivity filler for resin composite. Especially, viscosity of epoxy resin filled with developed low aspect ratio primary BN particles was lower than high aspect ratio primary BN particles. Thermal conductivity of epoxy resin filled with the large size agglomerated BN filler could reach up to 10 watt per meter per kelvin. The properties and evaluation of developed novel BN filler for high thermal conductivity packaging material have also been discussed.