Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content Filler Size and Filler Geometry

摘要

In this study, epoxy molding compounds (EMCs) with aluminosilicate (AlS) and aluminum oxide (AlO) were fabricated as fillers by a twin-screw-extruder (TSE) and shaped to plate samples using injection molding. AlS and AlO, electrical insulating mineral materials, were used as fillers to improve the thermal conductivity (λc) of composites. Composites with different filler particle sizes, filler contents and filler geometry were fabricated and the influence of these variables on the λc was studied. The λc of composites was measured with the hot-disk method. The distribution of fillers in composites was observed using scanning electron microscopy (SEM). Using the Lewis-Nielsen equation, experimental values of λc were compared with those predicted. The predicted results fit the experimental values well. The result showed that λc increases significantly when the filler content of composites is approximately over 50 vol %.