Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content, Filler Size and Filler Geometry

摘要

In this study, epoxy molding compounds (EMCs) with aluminosilicate (AlS) and aluminum oxide (AlO) were fabricated as fillers by a twin-screw-extruder (TSE) and shaped to plate samples using injection molding. AlS and AlO, electrical insulating mineral materials, were used as fillers to improve the thermal conductivity (λ c ) of composites. Composites with different filler particle sizes, filler contents and filler geometry were fabricated and the influence of these variables on the λ c was studied. The λ c of composites was measured with the hot-disk method. The distribution of fillers in composites was observed using scanning electron microscopy (SEM). Using the Lewis-Nielsen equation, experimental values of λ c were compared with those predicted. The predicted results fit the experimental values well. The result showed that λ c increases significantly when the filler content of composites is approximately over 50 vol %.