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Photonic integration in the palm of your hand: Generic technology and multi-project wafers, technical roadblocks, challenges and evolution

机译:轻松掌握光子集成:通用技术和多项目晶圆,技术障碍,挑战与发展

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Mimicking the path of the semiconductor electronics industry, the photonic integration ecosystem has adopted the philosophy of generic technologies. The driving motivation is to serve multiple application domains, and spread the use of photonic chip technologies and platforms. Complementing the generic model with shared access to multi-project wafer runs, a cost-effective framework to start up in photonic integration has been established in the previous ten years. However, a larger adoption of these models is hampered by several roadblocks, related to different aspects such as access to, tools for, know-how on and use of photonic integration generic technologies. In this paper, a review of the the ecosystem current state, the roadblocks and paths to move forward are presented.
机译:光子集成生态系统模仿了半导体电子产业的发展道路,采用了通用技术的理念。其驱动动机是服务于多个应用领域,并扩展光子芯片技术和平台的使用。通过共享访问多项目晶片运行的通用模型,在过去十年中已经建立了一个经济有效的框架来启动光子集成。但是,这些模型的广泛采用受到与不同方面(如光子集成通用技术的访问,工具,专有技术和使用)相关的若干障碍的阻碍。本文概述了生态系统的现状,前进的障碍和前进的道路。

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