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Photonic integration in the palm of your hand: Generic technology and multi-project wafers, technical roadblocks, challenges and evolution

机译:手掌中的光子集成:通用技术和多项目晶片,技术障碍,挑战和进化

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摘要

Mimicking the path of the semiconductor electronics industry, the photonic integration ecosystem has adopted the philosophy of generic technologies. The driving motivation is to serve multiple application domains, and spread the use of photonic chip technologies and platforms. Complementing the generic model with shared access to multi-project wafer runs, a cost-effective framework to start up in photonic integration has been established in the previous ten years. However, a larger adoption of these models is hampered by several roadblocks, related to different aspects such as access to, tools for, know-how on and use of photonic integration generic technologies. In this paper, a review of the the ecosystem current state, the roadblocks and paths to move forward are presented.
机译:模仿半导体电子工业的路径,光子集成生态系统采用了通用技术的理念。驾驶动机是为了服务多个应用域,并扩散使用光子芯片技术和平台。在过去的十年中建立了与多项目晶圆运行的共享访问的通用模型,这是一个经济高效的框架,在前十年内已经建立了在光子集成中启动。然而,这些模型的更大采用由几个障碍阻碍,与不同方面相关的不同方面,例如访问,专门的技术和使用光子集成通用技术。本文介绍了对生态系统当前状态,转向前进的路径的审查。

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